Job Description

Job Description

Job Description

We are looking for a highly motivated Mechanical/Thermal Engineer that will mainly be responsible for performing mechanical design on server hardware using Rivos chips and other electronic components. This position will report to the Thermal/Mechanical Engineering Manager.

• Responsibilities for this position include but not limited to: 
• Mechanical design at the component, board and chassis levels.
• Assembly design including high power ASIC’s, sockets, heat sinks. 
• Mechanical design of air/liquid cooled heat sinks & exchangers/cold plates.
• Closely working with board designers to determine dimensions, keep out zones, translate ECAD into MCAD and prepare board layouts.
• Collaborating with the other engineering teams (Reliability, SI/PI, Power, General HW) and making necessary changes on mechanical design. 
• Following the OCP guidelines, understanding the revisions/updates, attending appropriate OCP meetings and applying them to mechanical design of Rivos chassis. 
• Design of cables and bundling through Rivos chassis at various form factors. 
• Running FEA analysis at board and chassis levels to ensure Mechanical Integrity.
• Generating and maintaining BOM. 
• Working with CM, OEM and ODM’s to develop mockups, test samples and high-volume products.

• Team player with good communication and interpersonal skills. 
• Passionate about working in a startup environment, exploring, learning new techniques and applying them to product design.
• Must have experience with electro-mechanical design for rack mounted fixed & modular server or networking equipment.
• Must have experience working with CM, OEM and ODM’s.
• Experience with board/PCB/PWB mechanical design.
• Experience with cabling/bundling in electronic enclosures. 
• Experience with various fabrication processes including sheet metal, injection molding, soft and hard tooling. 
• Familiarity with OCP mechanical design guidelines and design of Colo boxes.
• Experience with air & liquid cooling systems. 
• Experience with tolerance analysis and ASME Y14.5 GD&T guidelines.
• Expert MCAD and PDM user (NX & Solidworks preferred).
• Experience with IDF and ECAD-MCAD transfer process.
• Ability of working on mock up design and preparing test setups and procedures for mechanical and thermal testing.
• Experience with design and manufacturing of fixtures for experiments, components for prototypes, etc.
• Good knowledge/use of MS or Google Office Suite.
• Implementing test plans: setting up and conducting tests or experiments with attention to detail.
• Good troubleshooting skills with mechanical/thermal design and testing.

• Familiarity with ANSYS Mechanical.
• Familiarity with Thermal Design Software, i.e. Ansys IcePak, is a big plus.
• Familiarity with airflow and/or wind tunnel measurements.

• Minimum education: B.S. degree in Mechanical/Thermal Engineering, Applied Mechanics or Science (Physics).
• Minimum 8 years of experience in a product development and/or qualification environment, preferably in electronics/semiconductor industry.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

Job Tags

Similar Jobs